Toshiba announced the launch of its new 64 gigabyte (GB) embedded NAND flash memory module, which is the highest capacity yet achieved in the industry. The 64GB NAND module combines sixteen 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba’s cutting-edge 32nm process technology, and also integrates a dedicated controller.
The new 64GB module is the flagship of the company’s new line-up of six embedded NAND flash memory modules, ranging from 2GB to 64GB. All of them offer full compliance with the latest eMMC standard, which provides up to 20MB/s write speeds and 37MB/s read speeds. These small and thin flash chips is ideal for use on mobile devices.
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Product Number
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Capa.
|
Package
|
Sample Shipment
|
Mass Production
|
| THGBM2G9DGFBAI2 | 64GB |
169Ball FBGA
14x18x1.4mm |
Dec. 2009
|
1Q, 2010
(Jan.-Mar.) |
|
THGBM2G8D8FBAIB
|
32GB
|
169Ball FBGA
12x16x1.4mm |
Feb. 2010
|
2Q, 2010
(Apr.-Jun.) |
|
THGBM2G7D4FBAI9
|
16GB
|
169Ball FBGA
12x16x1.2mm |
Jan. 2010
|
1Q, 2010
(Jan.-Mar.) |
|
THGBM2G6D2FBAI9
|
8GB
|
169Ball FBGA
12x16x1.2mm |
Mar. 2010
|
2Q, 2010
(Apr.-Jun.) |
|
THGBM2G5D1FBAI9
|
4GB
|
169Ball FBGA
12x16x1.2mm |
Apr. 2010
|
2Q, 2010
(Apr.-Jun.) |
|
THGBM2G4D1FBAI8
|
2GB
|
153Ball FBGA
11.5x13x1.2mm |
2Q, 2010
(Apr.-Jun.) |
3Q, 2010
(Jul.-Sep.) |
