In addition to the S5K4E5 BSI CMOS imager and the Orion ARM Cortex A9 processor, Samsung is bringing the 8GB and 16GB moviNAND embedded memory chips for use in smartphones. Samsung’s new NAND flash chip uses the e-MMC 4.41 specification, offering a more efficient operation, upgraded user experience, with a high priority interrupt (HPI) and improved background operation features.
Samsung has started producing 8GB moviNAND, using 30 nanometer (nm) class 32-gigabit (Gb) NAND flash chips in late July, and will start producing 16GB moviNAND using 20nm-class 32Gb NAND flash this month.
Samsung also introduces ultra-thin five chip MCP (multi-chip package) solutions which measure just 1mm. The moviNAND-based MCP will be available in combination with mobile DRAM, for use in mobile applications with high multimedia workload such as smartphones.
